CPU Coolers
CPU cooler solutions sorted by socket type. Wide range of selection from low profile blowers, passive server heatsink, and actively cooled heatsinks with high performance fans.
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Supports AMD Genoa Processors, Socket SP5
Aluminum Fins with Copper Heatpipes
Supports up to 615W TDP
Pre-applied Shin-Etsu 8195-4 Thermal Grease
Dimensions: 4.65" x 3.64" x 2.52"
Supports AmpereOne Socket LGA 5964
Aluminum, Copper Heatsink Base, Heatpipe, and Aluminum Fins
Supports 400W TDP at 41°C
Pre-applied Shin-Etsu X23-8079-2 Thermal Grease and Tflex HD7.5
Dimensions: 4.99" x 3.68" x 4.13"
Dimensions: 5.67" x 3.67" x 2.78"
Supports Intel LGA 2011 / LGA 2066 Narrow ILM
Aluminum Fins with Copper Heat Pipes
Up to 165W TDP
65.4 CFM at Max Duty Cycle
Dimensions: 4.4" x 3.23" x 4.33"
Supports LGA 2011 Narrow ILM
56x95mm Mounting Pitch
Pre-Printed Thermal Grease
Dimensions: 4.17" x 3.23" x 2.44"
Dimensions: 4.06" x 3.07" x 1.10"
Supports Intel Socket LGA 775
Aluminum Heatsink with Copper Base and Fan
Maximum 5500 RPM PWM Controlled Fan
Pre-printed Thermal Grease
Dimensions: 3.7" x 3.53" x 2.52"
Supports Intel Socket LGA 115x and LGA1200
Supports up to 125W TDP
TIG830SP Pre-printed Thermal Grease
Dimensions: 3.7" x 3.44" x 2.67"
Supports LGA 1156
Dimensions: 3.54" x 3.54" x 2.52"
Supports Intel PGA479
Copper Heatsink with CPU Fan
Pre-applied Shin-Etsu Thermal Grease
Dimensions: 1.97" x 1.97" x 0.98"
Supports Intel LGA 1356/1366
Copper Heatsink with Blower Fan
4-pin PWM Controlled Fan
Pre-Printed Shin Etsu Thermal Paste
Recommended for 1U Server
Aluminum Heatsink with Copper Heatpipes
Recommended for 2U Server
Recommended for Tower PC and Workstations
Compatible with Ampere Altra, Socket LGA 4926
Copper Passive heatsink
Recommended for 1U Servers
Shin-Etsu X23-8079-2 Thermal Grease
Dimensions: 120 x 82 x 27.7 mm, 4.72" x 3.23" x 1.09" (in inches)
Supports AMD Socket AM2 CPU
Aluminum Stacked Fin with Copper Base
3-pin Fan
Supports up to TDP 125 Watts
Recommended for 2U Server and up
Aluminum Heatsink with Embedded Heatpipes and 4-Pin PWM Fan
Recommended for 3U Servers
Shin-Etsu X23-8079-2 Thermal Grease by syringe
Dimensions: 5.13" x 3.29" x 4.33" (in inches)
Supports Intel Socket LGA 115x and LGA1200 up to 125W TDP
Supports Intel Socket LGA 1356/1366 up to 95W TDP
Aluminum Radial Heatsink and Fan
Dimensions: 4.17" x 4.17" x 2.86"
Cold Plate supports Intel LGA4677
Connectors Compatible with CPC, Staubli, and Pipe Threads
Maximum Power 1080W@1 LPM with Ambient Temp 20°C
Normal Operating Pressure: 40 psi, Maximum: 120 psi
Recommended Flow Rate: <2 L/min
Supports LGA 2011 Square ILM
80x80mm Mounting Pitch
Dimensions: 3.54" x 3.54" x 2.44"
Dimensions: 3.54" x 3.54" x 2.45"
Compatible with LGA 4926
Compatible with Ampere Altra Family Processors
Supports up to 250W TDP
Water Pump with Powerful Flow Rate 1.7 Liter Per Minute
Pre-Printed Shin-Etsu Thermal Grease
Supports Intel Sapphire Rapid Processors, LGA 4677
Supports up to 340W TDP
Copper Vapor Chamber Base and Fin Stack
Passive Cooler for 1U
Dimensions: 4.6" x 3.1" x 1.0"
Supports Intel Granite Rapids SP Processors, LGA7529
Aluminum Heatsink with Copper Heat Pipes and Side Fan
Supports up to 570W TDP
Pre-applied Shin-Etsu 7762 Thermal Grease
Dimensions: 5.5" x 3.85" x 4.2"
Supports Intel Alder Lake-S Socket LGA 1700
Aluminum Fins with Copper Base Heatsink
Supports up to 155W TDP
Dimensions: 3.54" x 3.54" x 2.6"
Supports Intel Socket LGA 4710
Water Pump with Flow Rate 2.9 Liter Per Minute
Supports up to TDP 350 Watts
Recommended for 1U Server and up
Supports Intel Socket LGA 3647 Narrow
Supports up to 230W TDP
Pre-applied Shin-Etsu 7622 Thermal Grease
Radiator Dimensions: 7.4" x 2.9" x 1.57"
Supports AMD EPYC Socket SP6 or Ryzen Socket sTR5
Supports up to 225W TDP
Supports Intel LGA1851/1700, AMD AM5/AM4
Recommended for 2U, Tower PC and Workstations
Compatible with Intel LGA1700/1200/115X
Compatible with AMD AM3/AM2+/AM2
Dynatron PUMP67 Liquid Cooler Pump
2 Ports (7.8mm OD)
Dimensions: 67 x 67 x 35.4mm
Liquid Cooler Cold Plate
Compatible with LGA 1200/115x, AMD AM3
40 psi Max Normal Operating Pressure
120 psi Max Allowable Pressure
40.53 CFM at Max Duty Cycle
Dimensions: 4.4" x 3.3" x 2.64"
Supports Intel LGA 1851/1700/1200/115X
Supports AMD AM4/AM5
Supports Intel 205W TDP, Supports AMD 170W TDP
Radiator Dimensions: 8.03" x 1.77" x 2.95"
Supports Intel Alder Lake-S Socket LGA 1700 / LGA 1851
Aluminum Base and Fins with Heatpipes
Supports up to 195W TDP
Pre-applied Shin-Etsu X23-8079-2 Thermal Grease
Dimensions: 3.74" x 3.74" x 5.12"
Supports up to 350W TDP
Radiator Dimensions: 12.0" x 3.3" x 4.6"
Supports Intel Sapphire Rapids, Emerald Rapids Processors, LGA4677
Supports up to 600W TDP
Radiator Dimensions: 3.39" x 10.95" x 1.57"
Supports AMD Ryzen Socket AM4/AM5
Aluminum Heatsink with Heat Pipes and Side Fan
80x38mm 8000 RPM Side Fan
Pre-Printed Shin-Etsu X23-8079-2 Thermal Grease
Dimensions: 4.23" x 3.07" x 4.33"
Supports Intel Socket LGA 1700
Supports up to 115W TDP
Copper Base and Aluminum Fins with Heatpipe
Shin-Etsu 7762 Thermal Grease in Syringe
Dimensions: 3.68" x 3.74" x 1.18"
Copper Heatsink with Skiving Fins
Supports up to 130W TDP
Dimensions: 3.54" x 3.54" x 1.06"
Supports Intel Socket LGA1200/LGA115X
4-pin PWM fan with Copper base, Aluminum fins heatsink
Supports Intel Granite Rapids SP Processors, LGA 7529
Copper Vapor Chamber with Copper Fins
Supports up to 400W TDP
Dimensions: 4.99" x 3.85" x 1.05"
Supports Intel Granite Rapids SP Processors, LGA4710
Supports up to 700W TDP
Radiator Dimensions: 3.29" x 4.64" x 11.7"
Recommended for 2U Servers
Dimensions: 125 x 79 x 158 mm, 4.9" x 3.1" x 6.2" (in inches)
Recommended for Tower PCs
Supports Intel LGA 115X/1200/1356/1366/1700
AMD Socket AM4/AM5/FM2+/FM2/AM2/AM2+/AM3/AM3+/FM1
Water Pump with Flow Rate 3.2 Liter Per Minute
Radiator Dimensions: 10.9" x 2.9" x 1.57"
Supports Intel Socket FCLGA 4710
4-pin PWM Blower, Copper Heatsink and Copper Vapor Base
Supports up to 205 Watts Heat Dissapation
Includes E1B Package Carrier
4-pin PWM Blower, Aluminum Stacked Fins with Heat Pipes
Supports up to 350 Watts Heat Dissapation
Recommended for 3U Server and up
Supports Socket Intel LGA 4710, Granite Rapids Processors
Supports up to 550W TDP
Aluminum Heatsink, Copper Heatpipes, and PWM Blower
Dimensions: 4.6" x 3.2" x 2.6"
4-pin PWM Blower, Copper Heatsink with Vapor Chamber Base
Supports Intel Sapphire Rapid Processors, LGA 4710
5 Heatpipes with Vapor Chamber Base and Aluminum Fins
Passive Cooler for 2U
Dimensions: 4.6" x 3.1" x 2.5"
Supports up to 205W TDP
Dimensions: 4.6" x 3.1" x 1.1"
Dimensions: 5.2" x 3.9" x 2.6"
Aluminum Heatsink with Copper Heat Pipes
Supports up to 450W TDP
Dimensions: 4.99" x 3.85" x 2.52"
Supports up to 500W TDP
Radiator Dimensions:3.39" x 10.95" x 1.57"
Supports Intel Xeon E3 Series Processor
Supports CPU Socket LGA1150/1155
Supports Max 95W TDP
Supports AMD Socket SP6 CPU
Aluminum Stacked Fin with heat Pipes
Supports up to TDP 225 Watts
Recommended for 3U Server and up, Workstation
Compatible with AMD Socket SP5
Three 40x28mm Cooling Fan with 4-Pin PWM Connector
Dimensions: 3.15" x 3.15" x 0.59"
Supports AMD Socket SP6
Up to 140 Watts Heat Dissapation
Aluminum Base, Aluminum Stacked Fins with Heatpipes
Pre-applied Shin-Etsu 7762 Thermal Paste
Supports AMD Epyc Processor Socket SP6
Copper Heatsink with Vapor Chamber Base
4-pin PWM Controlled Blower
Supports up to TDP 140 Watts
Supports AMD EPYC Processors, Socket SP6
Supports up to TDP 205 Watts
Compatible Intel LGA4677
Water Pump with Powerful Flow Rate 2.9 Liter Per Minute
Supports Intel Socket 1700, Alder Lake/Raptor Lake
Supports Up to 65W Maximum Power
4-pin PWM Fan with Aluminum Radial Fin
Pre-Print Shin-Etsu Thermal Paste
Dimensions: 3.66" x 3.66" x 1.23"
Compatible Intel LGA115x, LGA1366, LGA1700, LGA2011/2066 Square ILM Mounting
Compatible AMD AM2, AM3, AM4, AM5, FM1, FM2
Four 80x38mm Cooling Fan with 4-Pin PWM Connector
Supports Socket Intel LGA 4677, Sapphire Rapids Processors
Supports Intel Socket LGA1700/1200/115X
Supports AMD Socket AM4/AM5
Copper Base, Aluminum Fins, Embedded Heat Pipes
3200 RPM Fan, 35.78 CFM at Full Duty Cycle
Supports Intel LGA115x, LGA1700, LGA2011/2066 Square ILM
Supports AMD Socket AM2, AM3, AM4, AM5, FM1, FM2
Supports up to 250 Watts Heat Dissapation
5 x 18000 RPM PWM Cooling Fans
Shin-Etsu 7762 Pre-Printed Thermal Compound
Supports Intel Socket LGA 115X/2011/2066/1356/1366/1700
Supports AMD AM2/AM3/AM2+/AM3+/FM1/FM2
Supports up to Intel CPU TDP 210 Watts
Supports up to AMD CPU TDP 170 Watts
Supports AMD Epyc Processor Socket SP3
Aluminum Heatsink with Heatpipe
Supports up to TDP 280 Watts
Aluminum Radial Fin Heatsink with Copper Core
Supports up to 145W TDP
Heatpipes with Aluminum Stack Fins
11000 RPM Blower Fan, 58.31 CFM at Full Duty Cycle
Supports up to 170W TDP
Heatpipes with Aluminum Base and Aluminum Fin Stack
1800 RPM Blower Fan, 35.03 CFM at Full Duty Cycle
Recommended for 4U Server and up
Supports AMD Ryzen Socket AM4 or AM5
Up to 120 Watts Heat Dissapation
Aluminum Stacked Fins with Heatpipes
Dimensions: 4.13" x 2.91" x 2.48"
Supports up to 105W TDP
8700 RPM Blower Fan, 26.25 CFM at Full Duty Cycle
Three 80x38mm Cooling Fan with 4-Pin PWM Connector
Dimensions: 4.33" x 3.15" x 1.06"
Supports Intel Socket FCLGA 4677
Supports up to 95W TDP
8600 RPM Blower Fan, 26.25 CFM at Full Duty Cycle
Supports Intel Socket LGA 115X, LGA1200
Aluminum Fins with Heatpipes
Supports up to 125W Heat Dissipation
DImensions: 3.85" x 3.85" x 4.33"
Supports Intel Whitley Platform: Ice lake and Cooper Lake
Socket LGA4189-4/5
Dimensions: 4.17" x 4.17" x 2.44"
Copper Vapor Chamber Heatsink with Stacked Fins
Dimensions: 3.74" x 3.7" x 1.11"
Supports Intel LGA 1700/1200/115X
Supports AMD Socket AM5 and AM4
Aluminum Fins with Copper Heat Pipes, and Heatpipe with PWM Fan
Dimensions: 4.9" x 6.2" x 3.1"
Supports Intel Alder Lake S Processors, LGA 1700
Aluminum Extruded Heatsink, PWM Fan, with M3 Screw Mount
Supports up to 65W TDP
Dimensions: 3.74" x 3.74" x 1.61"
Copper Base, Aluminum Fins, and Heatpipe with PWM Fan
Dimensions: 3.68" x 3.74" x 1.39"
Copper Heatsink with Blower, Push-pin Mounting
Dimensions: 3.6" x 3.5" x 1.1"
Supports AMD Genoa, Socket SP5
Heatpipes and Copper Heat Spreader with Aluminum Base
Supports up to 320W TDP
Dimensions: 4.7" x 3.6" x 4.1"
Heatpipes with Aluminum Fin Base and Stack
Supports up to 300W TDP
Dimensions: 4.7" x 3.6" x 2.6"
Aluminum Stacked Fins with Copper Embedded Aluminum Base
Dimensions: 4.7" x 3.6" x 2.5"
Copper Vapor Chamber and Stacked Fins with Blower
Supports up to 260W TDP
Dimensions: 4.7" x 3.6" x 1.1"
Copper Vapor Chamber and Fin Stack
Dimensions: 4.65" x 3.64" x 1.06"
Dimensions: 4.65" x 3.64" x 0.98"
Supports Intel Cascade Lake, Skylake (LGA3647 Narrow ILM)
Supports Intel Cooper Lake, Ice Lake (LGA 4189)
Supports AMD Socket sWRX8, sTRX4, TR4, SP3
Supports up to 300 Watts Heat Dissapation
Supports Intel Socket FCLGA 3647 Narrow ILM
Supports Intel Cooper Lake, Ice Lake Processors Socket LGA 4189
Aluminum Stacked Fins with Heat Pipes
4-Pin PWM Controlled Blower
Supports up to 270W TDP
Recommended for 3U Server and Up
Supports Intel Socket LGA115x, LGA1200
Copper Base with Aluminum Stacked Fins
Supports AMD Socket AM2, AM3, AM4, FM1, FM2
5 x 12000 RPM PWM Cooling Fans
Supports Intel LGA 115x/1200, Rocket Lake Core Processors
Supports up to 55W TDP
Aluminum Heatsink and PWM Blower
Dimensions: 4.7" x 3.2" x 4.3"
Aluminum Fins, 4 x Heatpipes with HCC Technology
Dimensions: 3.58" x 3.58" x 4.33"
Copper Base, Aluminum Fins with Heatpipes
Dimensions: 3.6" x 3.3" x 2.6"
Compatible Intel LGA 4189, Ice Lake and Cooper Lake
Compatible Intel LGA1200/115X, AMD AM4
Two 120mm Cooling Fan with 4-Pin PWM Connector
Supports Threadripper and EPYC Processors (sTRX4, TR4, SP3)
Aluminum Heatsink with Embedded Heatpipes
Supports up to 280W TDP
Socket FCLGA 3647-0 Narrow Mounting Mechanism
4-Pin PWM 3800RPM Cooling Fan
Compatible with SYS-5049A-T
4U Active Heatsink and Fan
Supports Intel Whitley Platform: Ice Lake, Cooper Lake
LGA 4189-4/5, Socket P4/P5 or Socket P+
Aluminum Stacked Fins with Embedded Copper Heat Pipes
Up to 205 Watts CPU Heat Dissapation
Dimensions: 4.45" x 3.23" x 2.60"
Supports Intel Xeon E3 Series Processor, Socket H Series
Supports CPU Socket LGA1155/1156
Supports Max 105W TDP
Aluminum heatsink with Heatpipes, Side Fan
Dimensions: 4.69" x 3.11" x 2.56"
Fractal Design Celsius+ S28 Dynamic AIO Liquid Cooler
280mm Radiator, 2 x 140mm Fans
Two Dynamic X2 GP-14 Fans, ARGB Accented Pump
Pre-applied Thermal Paste
5-Year Manufacturer's Limited Warranty
Fractal Design Celsius+ S28 Prisma AIO Liquid Cooler
Two Prisma AL-14 PWM ARGB Fans, ARGB Accented Pump
Copper Heatsink with with Skiving Fins
GE-Toshiba TIG830SP Pre-printed Thermal Grease
Supports AMD Ryzen (AM4)
Up to 105 Watts Heat Dissapation
Dimensions: 4.17" x 2.91" x 1.06"
Supports AMD Threadripper (sTRX4, TR4) and AMD EPYC (SP3)
Up to 180 Watts Heat Dissapation
Dimensions: 4.45" x 3.15" x 2.52"
Socket AM4 Retention Bracket
Compatible with Dynatron L3 or L5 Liquid Cooler
Includes Bracket and Screw only
Manufacturer Part Number: DY-RT-AM4
Compatible with Socket FCLGA3647 Narrow ILM
Active Blower and Copper Heatsink with Vapor Chamber
Pre-Printed Shin-Etsu 7762 Thermal Grease
Recommended for 1U Server and Up
Aluminum Fin Stack, 5 Heatpipes with Vapor Chamber Base
Recommended for 2U Server and Up
Compatible with Narrow ILM FCLGA3647
120mm Cooling Fan with 4-Pin PWM Connector
Compatible with FCLGA4189 (Ice Lake, Cooper Lake)
Fully Support CPU Powered Heat Dissipation with 12CFM Airflow
Intel Standard Anti-Tilt Rotating Heatsink Captive Mounting Sets
Supports up to 270W TDP with 23CFM Airflow
Aluminum Base and Stacked Fins, Copper Heatpipes
Low Profile 37mm Height
Supports AMD Socket AM4 Processors
Supports Maximum 95W CPU TDP
Copper Base and Heatpipes with Aluminum Cooling Fins
Supports Intel LGA1200, LGA1151, LGA155, LGA1156
Supports Maximum 130W CPU TDP
Compatible with AMD EPYC or Threadripper (Socket SP3, Socket TR4)
Pre-printed Shin-Etsu Thermal Grease
All In One Liquid Cooler
AMD Socket SP3/TR3/TR4
For 1U Server Applications
3 x 40mm 12000 RPM PWM Cooling Fans
Cold Plate Module with Copper Base
Supports up to TDP 250 Watts
Supports Intel LGA 1151
Supports Intel Socket FCLGA 3647 with Narrow ILM
Passive Copper Stacked Fin with Vapor Chamber Base Heatsink
Supports Intel Socket LGA 2011/2066 with Square ILM
Supports up to TDP 165 Watts
Supports Intel Socket LGA 1151/1155/1156
Passive Copper Heatsink with Skiving Fins
Supports up to TDP 95 Watts
4-pin PWM fan with Aluminum Radial Fin heatsink
Supports up to TDP 73 Watts
Recommended for 1.5U Server and up, Mini-ITX
Supports Intel Socket FCLGA 3647 Square ILM
Aluminum Heatsink with Heatpipes
Copper Heatsink with Vapor Chamber
Aluminum heatsink with heatpipe
Aluminum Stacked fin on Copper base with Heatpipes
Aluminum Heatsink with heatpipes
4-pin PWM Controlled fan
Copper heatsink with Skived Fins
Copper Stacked Fins with Vapor Chamber Base
Copper Skived Fin Passive Heatsink
Supports AMD Epyc Processors, Socket SP3
Supports up to TDP 120 Watts
Supports up to TDP 180 Watts
Supports AMD Socket AM4 CPU
4-pin PWM Blower with Copper Fins
Low-Profile CPU Cooler for Intel Core Processors
LGA 1150/1155/1156
Supports Maximum 65W TDP
Supports CPU Socket LGA2011
Copper Vapor Chamber heatsink with Aluminum Stacked Fins
Support TDP 160 Watts heat dissipation
Shin-Etsu 7762 Thermal Grease pre-printed Overall Dimension: 90.0 x 90.0 x 41.5 mm
Weight: 480 g
Supports Narrow ILM Socket LGA2011
Copper heatsink with PWM controlled blower
Supports 160W TDP
Pre-Printed Shin-Etsu G751 Thermal Grease
Intel LGA 2011 (Socket R)
Intel Xeon, Core i7
Intel Core i7, Xeon E5
LGA 2011 (Socket R)
Socket R LGA 2011
150W TDP Max.
Dual ball-bearing blower
Intel Core 2 Quad, Extreme, Duo, Intel Pentium Dual Core, 4 Extreme Edition, Intel Celeron D, Intel Xeon
LGA 775 (Socket T)
Space Saver Light Weight Radiator
120mm Cooling Fans with 4-Pin PWM Connector
Stand-alone Water Pump with Powerful Flow Rate 0.84 Litter Per Minute
30cm Black Pair EPDM Tube Assembled
Mounting Accessories are included
Shin-Etsu Series Thermal Compound Pre-Printed on Base
Support CPU Overclocking Power Mode up to 200Watts Heat Dissipation
Supports LGA 1150, 1155 and LGA 1156 CPUs with 73W TDP Max.
Copper Heatsink w/ pre-printed thermal compound
75mm Alloy-frame PWM, double ball-bearing blower
Easy-to-install push-pin design
Intel Core i7 / i5 / i3 and Xeon Processors
LGA 1155 (Socket H2), LGA 1156 (Socket H)
Intel LGA 1155 / 1156 (Socket H2, H)
Intel Xeon, Core i3/i5/i7
Intel Core i3/i5/i7
Intel Xeon
Intel LGA1155 /1156
Intel Core i3/i5/i7 Mobile CPU Cooler
Socket G (PGA988)
Convenient heat sink captive screw mounting
Shin-Etsu 7762 Thermal Grease pre-printed
Support TDP 165 Watts heat dissipation
