Embedded Systems
Networking Systems
High Performance Systems
Ultra Small Form Factor
Deep Learning Systems
Industrial Automation
Panel PCs
Digital Signage
Mini Servers
Short 1U Rack
1U Rackmount
2U Rackmount
4U Rackmount
Tower Servers
Virtualization
Storage Servers
Motherboards
CPU Coolers
Graphics Cards
Memory
Storage Drives
Wireless
Cases
Power Supplies
Case Fans
Everything Else
Socket AM4 Retention Bracket
Compatible with Dynatron L3 or L5 Liquid Cooler
Includes Bracket and Screw only
Manufacturer Part Number: DY-RT-AM4
Intel Core i3/i5/i7
Intel Xeon
Intel LGA1155 /1156
Supports Intel Socket LGA 1151/1155/1156
4-pin PWM fan with Aluminum Radial Fin heatsink
Supports up to TDP 73 Watts
Recommended for 1.5U Server and up, Mini-ITX
Supports Intel Alder Lake S Processors, LGA 1700
Aluminum Extruded Heatsink, PWM Fan, with M3 Screw Mount
Supports up to 65W TDP
Pre-applied Shin-Etsu 7762 Thermal Grease
Dimensions: 3.74" x 3.74" x 1.61"
Supports Intel Socket 1700, Alder Lake/Raptor Lake
Supports Up to 65W Maximum Power
4-pin PWM Fan with Aluminum Radial Fin
Pre-Print Shin-Etsu Thermal Paste
Dimensions: 3.66" x 3.66" x 1.23"
Intel Core i3/i5/i7 Mobile CPU Cooler
Socket G (PGA988)
Supports Intel LGA 115x/1200, Rocket Lake Core Processors
Supports up to 55W TDP
Aluminum Heatsink and PWM Blower
Dimensions: 4.7" x 3.2" x 4.3"
Low-Profile CPU Cooler for Intel Core Processors
LGA 1150/1155/1156
Supports Maximum 65W TDP
Intel Core i7, Xeon E5
LGA 2011 (Socket R)
Supports Narrow ILM Socket LGA2011
Copper Vapor Chamber heatsink with Aluminum Stacked Fins
Convenient heat sink captive screw mounting
Shin-Etsu 7762 Thermal Grease pre-printed
Support TDP 165 Watts heat dissipation
Passive Copper Heatsink with Skiving Fins
Supports up to TDP 95 Watts
Recommended for 1U Server and up
Compatible with Intel LGA1151 and AMD AM4
Dual Ball Bearing Fan with Aluminum Heatsink with Heatpipes
Supports CPU up to 100W TDP
Supports AMD Threadripper (sTRX4, TR4) and AMD EPYC (SP3)
Up to 180 Watts Heat Dissapation
Aluminum Base, Aluminum Stacked Fins with Heatpipes
Pre-applied Shin-Etsu 7762 Thermal Paste
Dimensions: 4.45" x 3.15" x 2.52"
Supports Intel Alder Lake-S Socket LGA 1700
Aluminum Radial Fin Heatsink with Copper Core
Supports up to 125W TDP
Dimensions: 4.17" x 4.17" x 2.44"
Supports Intel Socket LGA 115X, LGA1200
Aluminum Fins with Heatpipes
Supports up to 125W Heat Dissipation
DImensions: 3.85" x 3.85" x 4.33"
