Dynatron K1: LGA1155, LGA1156 Intel Core and Xeon Passive 1U Heatsink – MITXPC
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Dynatron K1: LGA1155, LGA1156 Intel Core and Xeon Passive 1U Heatsink

  • Intel Core i3/i5/i7

  • Intel Xeon

  • Intel LGA1155 /1156

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$14.95

DESCRIPTION
TECHNICAL SPECIFICATIONS

OVERVIEW

Dynatron K1 1U aluminum heatsink for Intel LGA1155 and LGA1156 applications. Compatible with Intel Core i3/i5/i7 and Xeon processors with a maximum TDP of 95W. The K1 features a solid aluminum skived heatsink for efficient heat dissipation. The K1 passive heatsink is designed to be used in conjunction with chassis cooling; the 1U chassis must have active cooling, e.g., fans. Includes frame components for screw-mounting and thermal grease is pre-applied; no additional thermal compound is required.

KEY FEATURES

  • Intel Core i3/i5/i7

  • Intel Xeon

  • Intel LGA1155 /1156