| Dynatron K1: LGA1155, LGA1156 Intel Core and Xeon Passive 1U Heatsink | |
| Compatibility | Intel LGA1155, LGA1156 Intel Core i3/i5/i7 CPU Intel Xeon CPU Max TDP 95W |
| Dimensions | 95.0 x 95.0 x 26.5mm (1U compliant) |
| Heatsink | Material: Aluminum Pre-printed thermal compound: GE-Toshiba TIG830SP |
| Other | RoHS Compliant |