Dynatron Q17 Socket LGA 1700/1851 Copper CPU Heatsink 195W TDP – MITXPC
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Dynatron Q17 Socket LGA 1700/1851 Copper CPU Heatsink 195W TDP

  • Supports Intel Socket LGA 1700/1851

  • Copper Heatsink with Skiving Fins

  • Supports up to 195W TDP

  • Pre-applied Shin-Etsu X23-8195 Thermal Grease

  • Dimensions: 3.7" x 3.7" x 1.06"

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$39.95

DESCRIPTION
TECHNICAL SPECIFICATIONS

OVERVIEW

Recommend for Intel Alder Lake S Processor, Socket LGA 1700/1851, Copper heatsink with skiving fins. Support 195 Watts CPU Power Heat Dissipation for 1U & Up Server Solution.

KEY FEATURES

  • Supports Intel Socket LGA 1700/1851

  • Copper Heatsink with Skiving Fins

  • Supports up to 195W TDP

  • Pre-applied Shin-Etsu X23-8195 Thermal Grease

  • Dimensions: 3.7" x 3.7" x 1.06"