Dynatron B4 Intel Narrow ILM FCLGA 3647 Copper Heatsink 1U Rackmount, – MITXPC
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Dynatron B4 Intel Narrow ILM FCLGA 3647 Copper Heatsink 1U Rackmount, 205W TDP

  • Supports Intel Socket FCLGA 3647 with Narrow ILM

  • Passive Copper Stacked Fin with Vapor Chamber Base Heatsink

  • Supports up to TDP 205 Watts

  • Recommended for 1U Server and up

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$49.95

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DESCRIPTION
TECHNICAL SPECIFICATIONS

OVERVIEW

Dynatron B4 heatsink supports Intel FCLGA 3647 Socket CPU with Narrow ILM. The copper stacked fins with vapor chamber base heatsink comes with pre-applied Shin-Etsu thermal grease. Recommended for 1U rackmount server solutions up to 205W TDP.

KEY FEATURES

  • Supports Intel Socket FCLGA 3647 with Narrow ILM

  • Passive Copper Stacked Fin with Vapor Chamber Base Heatsink

  • Supports up to TDP 205 Watts

  • Recommended for 1U Server and up

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