Dynatron Q1 Alder Lake-S Socket LGA 1700 Copper CPU Heatsink 125W TDP – MITXPC
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Dynatron Q1 Alder Lake-S Socket LGA 1700 Copper CPU Heatsink 125W TDP

  • Supports Intel Alder Lake-S Socket LGA 1700

  • Copper Heatsink with Skiving Fins

  • Supports up to 130W TDP

  • Pre-applied Shin-Etsu 7762 Thermal Grease

  • Dimensions: 3.54" x 3.54" x 1.06"

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$34.95

DESCRIPTION
TECHNICAL SPECIFICATIONS

OVERVIEW

Recommend for Intel Alder Lake S Processor, Socket LGA 1700, Copper heatsink with skiving fins. Support 130 Watts CPU Power Heat Dissipation for 1U & Up Server Solution.

KEY FEATURES

  • Supports Intel Alder Lake-S Socket LGA 1700

  • Copper Heatsink with Skiving Fins

  • Supports up to 130W TDP

  • Pre-applied Shin-Etsu 7762 Thermal Grease

  • Dimensions: 3.54" x 3.54" x 1.06"