Dynatron R23 LGA2011 Narrow Aluminum Fins Copper Base CPU Heatsink 165 – MITXPC
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Dynatron R23 LGA2011 Narrow Aluminum Fins Copper Base CPU Heatsink 165W TDP

  • Supports LGA 2011 Narrow ILM

  • 56x95mm Mounting Pitch

  • Pre-Printed Thermal Grease

  • Dimensions: 4.17" x 3.23" x 2.44"

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$29.95

DESCRIPTION
TECHNICAL SPECIFICATIONS

OVERVIEW

Recommend for Intel Romley-EP / EX Platform, Sandy Bridge Processor, Socket LGA 2011 with Narrow ILM. Passive cooler for 2U and up. Aluminum Stacked fins with Copper base and heat pipes. Pre-printed thermal grease, supports CPU power up to 165 watts.

KEY FEATURES

  • Supports LGA 2011 Narrow ILM

  • 56x95mm Mounting Pitch

  • Pre-Printed Thermal Grease

  • Dimensions: 4.17" x 3.23" x 2.44"