Model Number | B6 |
CPU Support | Supports Intel FCLGA 3647 Square ILM only TDP 205W Max Recommended for 1U Server and up |
Dimensions | 90 x 90 x 27 mm 3.54" x 3.54" x 1.06" (in inches) |
Weight | 420g |
Features | Shin-Etsu 7762 Thermal Grease |
Dynatron B6 heatsink supports Intel Processors, Socket FCLGA 3647 Square ILM. Copper stacked find heatsink with vapor chamber base, pre-printed Shin Etsu 7762 thermal paste is passively cooled. Recommended for 1U servers and up with Intel Purley EP/EX processors with TDP 205W.