|CPU Support||Supports Intel FCLGA 3647
Square ILM only
TDP 205W Max
Recommended for 1U Server and up
|Dimensions||90 x 90 x 27 mm
3.54" x 3.54" x 1.06" (in inches)
|Features||Shin-Etsu 7762 Thermal Grease|
Dynatron B6 heatsink supports Intel Processors, Socket FCLGA 3647 Square ILM. Copper stacked find heatsink with vapor chamber base, pre-printed Shin Etsu 7762 thermal paste is passively cooled. Recommended for 1U servers and up with Intel Purley EP/EX processors with TDP 205W.