Embedded Systems
Networking Systems
High Performance Systems
Ultra Small Form Factor
Deep Learning Systems
Industrial Automation
Panel PCs
Digital Signage
Mini Servers
Short 1U Rack
1U Rackmount
2U Rackmount
4U Rackmount
Tower Servers
Virtualization
Storage Servers
Motherboards
CPU Coolers
Graphics Cards
Memory
Storage Drives
Wireless
Cases
Power Supplies
Case Fans
Everything Else
LGA 2011
Intel Core i7, Xeon E5
LGA 2011 (Socket R)
Supports Narrow ILM Socket LGA2011
Copper Vapor Chamber heatsink with Aluminum Stacked Fins
Convenient heat sink captive screw mounting
Shin-Etsu 7762 Thermal Grease pre-printed
Support TDP 165 Watts heat dissipation
Intel LGA 2011 (Socket R)
Intel Xeon, Core i7
150W TDP Max.
Socket R LGA 2011
Copper heatsink with PWM controlled blower
Supports 160W TDP
Pre-Printed Shin-Etsu G751 Thermal Grease
Supports Intel Socket LGA 2011/2066 with Square ILM
4-pin PWM fan with Copper base, Aluminum fins heatsink
Supports up to TDP 165 Watts
Recommended for 2U Server and up
Supports CPU Socket LGA2011
Support TDP 160 Watts heat dissipation
Shin-Etsu 7762 Thermal Grease pre-printed Overall Dimension: 90.0 x 90.0 x 41.5 mm
Weight: 480 g
Dual ball-bearing blower
Cold Plate Module with Copper Base
Space Saver Light Weight Radiator
120mm Cooling Fans with 4-Pin PWM Connector
Stand-alone Water Pump with Powerful Flow Rate 0.84 Litter Per Minute
30cm Black Pair EPDM Tube Assembled
Mounting Accessories are included
Shin-Etsu Series Thermal Compound Pre-Printed on Base
Support CPU Overclocking Power Mode up to 200Watts Heat Dissipation
Supports Intel Socket LGA 115X/2011/2066/1356/1366/1700
Supports AMD AM2/AM3/AM2+/AM3+/FM1/FM2
Supports up to TDP 250 Watts
Recommended for 1U Server and up
Compatible Intel LGA1200/115X, AMD AM4
Supports up to 250W TDP
Water Pump with Powerful Flow Rate 1.7 Liter Per Minute
Pre-Printed Shin-Etsu Thermal Grease
Two 120mm Cooling Fan with 4-Pin PWM Connector