Cold Plate supports Intel LGA4677

Connectors Compatible with CPC, Staubli, and Pipe Threads

Maximum Power 1080W@1 LPM with Ambient Temp 20°C

Normal Operating Pressure: 40 psi, Maximum: 120 psi

Recommended Flow Rate: <2 L/min

Supports Intel Sapphire Rapid Processors, LGA 4677

Supports up to 340W TDP

Copper Vapor Chamber Base and Fin Stack

Passive Cooler for 1U

Dimensions: 4.6" x 3.1" x 1.0"

Supports Intel Sapphire Rapids, Emerald Rapids Processors, LGA4677

Water Pump with Flow Rate 2.9 Liter Per Minute

Supports up to 600W TDP

Pre-applied Shin-Etsu X23-8079-2 Thermal Grease

Radiator Dimensions: 3.39" x 10.95" x 1.57"

Compatible Intel LGA4677

Water Pump with Powerful Flow Rate 2.9 Liter Per Minute

Pre-Printed Shin-Etsu Thermal Grease

Three 40x28mm Cooling Fan with 4-Pin PWM Connector

Supports Socket Intel LGA 4677, Sapphire Rapids Processors

Supports up to 350W TDP

Aluminum Heatsink, Copper Heatpipes, and PWM Blower

Pre-applied Shin-Etsu 7762 Thermal Grease

Dimensions: 4.6" x 3.2" x 2.6"

Supports Intel Socket FCLGA 4677

4-pin PWM Blower, Copper Heatsink and Copper Vapor Base

Supports up to 205 Watts Heat Dissapation

Recommended for 1U Server and up

Includes E1B Package Carrier

Supports Intel Socket FCLGA 4677

4-pin PWM Blower, Aluminum Stacked Fins with Heat Pipes

Supports up to 300 Watts Heat Dissapation

Recommended for 3U Server and up

Includes E1B Package Carrier

Supports Intel Socket FCLGA 4677

4-pin PWM Blower, Copper Heatsink with Vapor Chamber Base

Supports up to 205 Watts Heat Dissapation

Recommended for 1U Server and up

Includes E1B Package Carrier

Supports Intel Sapphire Rapid Processors, LGA 4677

Supports up to 300W TDP

5 Heatpipes with Vapor Chamber Base and Aluminum Fins

Passive Cooler for 2U

Dimensions: 4.6" x 3.1" x 2.5"

Supports Intel Sapphire Rapid Processors, LGA 4677

Supports up to 205W TDP

Copper Vapor Chamber Base and Fin Stack

Passive Cooler for 1U

Dimensions: 4.6" x 3.1" x 1.1"