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Product ID: G751-0.5G
Dynatron G751-0.5G Shin-Etsu MicroSi Thermal CPU Heatsink Compound Paste (0.5g)
Dynatron G751-0.5G Shin-Etsu MicroSi Thermal CPU Heatsink Compound Paste (0.5g)

Product ID: G751-0.5G

  • Excellent viscosity makes it easy to spread or remove without crack
  • Excellent thermal resistance (TR) and thermal conductivity(TC)
  • Stable homogeneous mixture for consistent thermal performance.

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Price: $5.99
  • Description
  • Technical Specifications

G751 is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu MicroSi Chemicla Co. Ltd. Through G751's superior heat dissipation, the G751 allows electronic devices to remian cooler and incerease their long term relibilty.

Dynatron G751-0.5G Shin-Etsu MicroSi Thermal CPU Heatsink Compound Paste (0.5g)
Product ID G751-0.5G
Injection Tube Dimensions 4.33" x 0.31" x 0.31"
Appearance Gray Paste
Application Injector with cap for easy application and storage Electroically non-conductive.
Compliance REACH, RoHS

 

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